This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Materials for Information Technology Devices, Interconnects and Packaging 1st Edition
Author(s): Ehrenfried Zschech; ‎Caroline Whelan; ‎Thomas Mikolajick
Publisher: Springer
ISBN: 9781852339418
Edition: 1st Edition
$39,99
Delivery: This can be downloaded Immediately after purchasing.
Version: Only PDF Version.
Compatible Devices: Can be read on any device (Kindle, NOOK, Android/IOS devices, Windows, MAC)
Quality: High Quality. No missing contents. Printable
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